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SYNOPEX manufacturing process can produce SMT components such as key-PBA for mobile FPCB (Flexible Printed Circuit Board), bio touch sensor module, camera module, wireless, communication module, IT devices module and other applicable .
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 SMT production process for FPCB
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SMT is a technology inserting components on the board by automatic devices on the line. The production line with the high-end machines, professional and enthusiastic team has created the perfect products to provide to the market.
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1. Insert FPCB
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- Checking F-PCB code
- Insert FPCB into Carrier/JIG
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2. Printer
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- Prepare Solder Scream
- Prepare metal Mask
- Prepare Squezze
- Setting printing mode, programme
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3. SPI
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- Setting checking mode as standard
- Check status of board after printed
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4. Mounter
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- Check LCR
- Confirm exact component
- Input components from reel or tray to board
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5. Reflow
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- Use reflow oven technology
- Set-up temperature, time, oxy concentration
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6. AOI
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- Check component mouting status by automatical optic.
- Check weld quality, plugging status, reading values.
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7. Auto Marking
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- Read data from AOI machine based on set-up coordinates
- Dot error points that AOI machine found.
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8. Xray
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- X-ray inspection.
- Check for open or breaked point, air bubbles inside the weld, hidden locations.
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9. Press
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- The process of using molds to create products.
- Large cutting speed.
- High precision.
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10. SMT Complete
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- Finish the SMT process, go to the stage of finishing the circuit board.
- Complete SMT step, move to circuit finishing stage.
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SMT production process with Rigid PBA
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SMT is a technology inserting components on the board by automatic devices on the line. The production line with the high-end machines, professional and enthusiastic team has created the perfect products to provide to the market.
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1. IQC
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- Check PCB code
- Input PCB to Carrier/JIG/ Magazine
- Check Metal Mask, JIG
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2. PRINT
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- Prepare Solder Scream
- Prepare metal Mask
- Prepare Squezze
- Setting printing mode, programme
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3. SPI
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- Setting checking mode as standard
- Check status of board after printed
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4. Mounter
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- Check LCR
- Confirm exact component
- Input components from reel or tray to board
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5. MOI
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- Check component mouting status by automatical optic.
- Check weld quality, plugging status, reading values.
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6. Reflow
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- Use reflow oven technology
-Set-up temperature, time, oxy concentration
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7. AOI
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- Check component mouting status by automatical optic.
- Check weld quality, plugging status, reading values.
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8. Xray
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- X-ray inspection.
- Check for open or breaked point, air bubbles inside the weld, hidden locations.
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9. Wave Solder
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- Using wave soldering technology to attach piercing components
- Setting Flux spraying time, wave height, ...
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10. OQC
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- Check the welding status, appearance of the CHIP, IC
- Check apprearance of Assy assembly
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Typical SMT products
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BOT side |
TOP side |
BOT side |
TOP side |
BOT side |
TOP side |
BOT side |
TOP side |
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